The Role of Pin Fin Heat Sinks in Advanced Electronics

The Global Pin Fin Heat Sink Market for IGBT size is predicted to reach USD 1.47 billion, with a CAGR of 5.2% by 2030. Pin fin heat sinks are heat exchangers designed with several pin-like structures, engineered in fin-based geometry, and are fabricated using metals like copper and aluminum. Heat sink’s function is dissipating the heat produced in the operation of electronic or mechanical devices, and maintaining the internal temperature equilibrium.